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Optically Networked : News: Unisphere Intros Multi-Service Edge Router


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Unisphere Intros Multi-Service Edge Router
January 28, 2002
By Optically Networked Staff

TriQuint Semiconductor Inc. (Quote) today announced the introduction of the TGA8652 Modulator Driver/Amplifier for High-Speed Optical Networking applications.

This high performance surface mount packaged device is targeted for the OC192/STM64 (10Gb/s) telecommunications market. The TGA8652 is capable of driving a Mach-Zehnder optical modulator at bit rates through 12.5Gb/s, providing overhead for the most comprehensive Forward Error Correction (FEC) algorithms.

The TGA8652 is ideally suited for Metro and Long-Haul Dense Wave Division Multiplexed (DWDM) systems that form the basis of today's optical networks, company officials said.

The TGA8652 combines a medium power, wideband AGC amplifier die with off-chip decoupling components assembled in a high performance surface mount package. The TGA8652 provides OEMs with a packaged amplifier solution that is easily integrated onto system line cards and optical modules using standard surface mount assembly processes.

The TGA8652 works with 9.9, 10.3, 10.7, and 12.5Gb/s optical Non-Return-to-Zero (NRZ) applications. The driver combines performance-enhancing features such as high gain, high voltage drive, and broad bandwidth, while also leading competitive devices in power efficiency. The TGA8652 may also be used as a low noise small signal 16dB gain block for data rates up to 12.5Gb/s.

The TriQuint TGA8652 has already been designed into several OC192/STM64 optical networking products by leading telecom systems and subsystems manufacturers. Production purchase orders have been received and the TGA8652 is currently shipping in pre-production volumes, ramping to full volume production in the second quarter of 2002.

This new driver/amplifier is part of a series of TriQuint Standard Product introductions specifically targeting the need for high-performance, integrated devices for the OC192/STM64 and OC768/STM256 telecom/datacom infrastructure build-out.


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