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Optically Networked : News: Broadcom Announces EDC Optical Networking Chip


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Broadcom Announces EDC Optical Networking Chip
March 9, 2005
By OpticallyNetworked Staff

Broadcom Corp., a provider of wired and wireless broadband communications semiconductors, earlier this week announced what it describes as a "highly integrated optical networking chip" that features electronic dispersion compensation (EDC) technology, which will help enable the widespread deployment of 10 Gigabit per second optical networks.

The low-power, high-performance EDC device is designed to extend transmission distance significantly by maintaining the integrity and quality of the signal, and improves networking efficiency, enabling a seamless, cost-effective upgrade to existing enterprise and metro service transport networks. The Broadcom solution helps enable the widespread deployment of 10 Gigabit per second (Gbps) optical networks.

Broadcom said that today's transport networks have a large installed base of legacy fiber links dominated by 1 Gigabit Ethernet (GbE) and OC-48 (2.48 Gbps) optical interconnect data transmissions. The increase in data traffic is driving the need to upgrade those fibers with 10GbE and OC-192 links. However, at the 10 Gbps rate, Broadcom said, legacy fiber protocols are subject to dispersion that can limit transmission distance and adversely affect the integrity of the signal itself. To avoid this limitation, EDC technology has proven to be a viable long distance solution by providing the throughput and distance improvements to enhance these legacy fiber applications.

EDC technology is supported by the Optical Internetworking Forum (OIF) — a group currently defining a 10 Gbps interoperability specification targeting optical links. The transmission distance of this specification supports up to 120 km (2400 ps/nm), however, the maximum distance currently supported is specified at up to 80 km. To achieve this reach extension and lower the cost of optics on existing fiber links, EDC technology provides customers an upgrade on existing OC-48 trunks beyond 80 km to OC-192, while enabling the use of low-cost optics without the need to re-engineer the link.

Utilizing a 0.13 micron CMOS process technology and consuming a little over 1 Watt of power, the BCM8105 features 9.9 Gbps to 11.1 Gbps clock and data recovery with a SFI-4 de-multiplexer that incorporates an adaptive EDC equalizer. This capability extends the reach of the signal and improves performance on DWDM (dense wavelength division multiplexing) metro and long-haul SONET/SDH transmission systems.

Based on three previous generations of high-speed CMOS silicon designed for the OC-48, OC-192 SONET/SDH and 10GbE markets, the new BCM8105 device is a multi-rate solution that provides full adaptation on the EDC equalizer with additional automatic tuning on the high-speed receiver threshold and phase levels for BER (bit-error rate) optimization.

To provide customers with smooth transitions in rolling out their EDC-based designs, Broadcom has developed a pin-compatible footprint with the BCM8129 CDR de-multiplexer, which is shipping in volume today and offers customers a lower cost high-speed receiver solution without the EDC filter.

For this chip development, Broadcom said it worked closely with its customers to help define, design and test next-generation systems using beta silicon that includes the EDC equalizer on-chip. As a result, the BCM8105 device was defined specifically to solve the dispersion issues associated with metro and long-haul SONET/SDH transmission links, enabling customers to move forward with EDC technology today.


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