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Parama Networks, a Santa Clara, Calif.-based fabless semiconductor company that specializes in producing systems on a chip (SOCs) for the telecommunications transport equipment market, and UMC, a Taiwan-based semiconductor foundry, today announced
that they have achieved first-pass silicon success of what the companies describe as "the
industry's first ADM-on-a-Chip (add/drop multiplexing)."
Parama reports that its new SoC for SONET/SDH architectures, introduced earlier this month is built on
UMC's 0.13 micron process.
"Parama required close collaboration with its foundry provider to
ensure we would deliver our chip to meet the
needs of our sophisticated customer base of network equipment
providers," said Hemant Bheda, CEO of Parama Networks. Bheda added that working with UMC no changes to the mask were required.
The ADM-on-a-Chip offers, according to Parama, all the functions necessary to build ADM and other
next-generation-network equipment, including cross-connect, line and
tributary framers, and overhead processing.
The SoC architecture is designed to simplify the equipment design process and
create cost and power reductions while providing scalability, flexibility, density and simplicity in building the next
generation of data-aware SONET and SDH systems.
Fu Tai Liou, head of the America Business Group at UMC said the partnership with Parama demostrates his company's capabilities to produce high-quality silicon results on deep
submicron processes within short market windows. "The development of
Parama's ADM implemented on a single piece of silicon is a significant
feat for both companies."
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